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Bump Engineering (External Manufacturing Operations _ Backend Engineering)

THE PERSON:

Creative, highly motivated self-driven individual team player with the demonstrated ability to independently complete complex engineering tasks onhead of time/Lead & Drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment.

KEY RESPONSIBILITIES:

• Responsible for Bump, Interposer and Fan-Out RDL yield, quality, cost and productivity overall improvement, and sustaining activities.
• Responsible for Bump, Interposer and Fan-Out RDL process baseline standardization and continuous improvement.
• Responsible for Bump Mask validation.
• Responsible for Bump-Packaging Interaction activities.
• Co-work with packaging BU on NPI and Ramp Up readiness at bump and interposer manufacturing site. Proactively communicate task assignments and report status timely to responsible parties.
• Responsible to manage performance of bump and interposer manufacturing site/supplier regarding yield & quality, out of control lots disposition, and any outliers reporting from internal or external parties.
• Plan and execute change management from internal or external parties.
• Drive bump, interposer and Fan-Out RDL manufacturer to enhance process, equipment & material capability for future generation/technology products.
• Assist in additional duties as deemed fit by supervisor.

PREFERRED EXPERIENCE:

• Experience in Bump or Wafer fab or 2.5D interposer or Wafer Level Fan-Out process engineering.
• Possess FCBGA or 2.5D assembly process knowledge and Chip Packaging Interaction knowledge.
• Familiar with DOE and JMP.
• Experience is Preparing reports /Presentation and ability to communicate Root cause and Resolution effectively.
• Good interpersonal communication and presentation skill.
• Fluent in both spoken and written English.

ACADEMIC CREDENTIALS:

• MS degree in Mechanical or Material or Chemical Engineering.

LOCATION:

Hsinchu, Taiwan

Requisition Number:183481
Job Function:Packaging Engineering

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